Senior Engineer – Flip Chip Packaging
Share
Job Location:
Monthly Salary:
Posted on:
2 hours ago
Vacancies:
1 Vacancy
Job Summary
Location: Dholera Gujarat
Employment Type: Full-Time
Industry: Semiconductor Manufacturing / Advanced Packaging
Experience: 5 10 Years
The Senior Engineer Flip Chip Packaging will lead the development qualification and manufacturing ramp of advanced flip chip packaging technologies. This role focuses on FC-BGA and FC-CSP process ownership new product introduction failure analysis and process control in a high-reliability semiconductor manufacturing environment.
Key Responsibilities-
Define develop and sustain Flip Chip (FC-BGA FC-CSP) packaging processes
-
Own bump formation solder reflow and underfill process development
-
Lead New Product Introduction (NPI) activities from bump design through package qualification
-
Analyze and resolve interconnect and package-level failures using advanced FA techniques
-
Work closely with substrate vendors and bumping equipment suppliers for process alignment
-
Establish process control plans SPC charts and FMEA for flip chip production lines
-
Support customer qualification reliability validation and technical reviews
-
Independently address customer technical issues related to flip chip packaging
-
Mentor junior engineers and drive cross-functional process improvement initiatives
-
Ensure compliance with JEDEC and IPC packaging standards
-
B.E./ in Materials Science Electronics Metallurgy or related engineering disciplines
-
5 10 years of hands-on experience in advanced IC packaging within OSAT or IDM environments
-
Strong understanding of solder bump technology UBM structures and substrate design rules
-
Experience with capillary underfill (CUF) and molded underfill (MUF) materials
-
Knowledge of thermal management warpage and co-planarity requirements for high-density packages
-
Hands-on failure analysis experience using C-SAM X-ray cross-sectioning SEM-EDX
-
Ability to work independently with cross-functional teams including design reliability and manufacturing
-
Exposure to Flip Chip WLP or advanced BGA platforms
-
Experience with automotive telecom or high-performance compute packaging
-
Knowledge of 2.5D / 3D IC integration HBM or TSV processes
Key Skills
- Continuous Integration
- Food Industry
- Minitab
- Packaging
- CAD
- Mechanical Knowledge
- Plastics Blow Molding
- SolidWorks
- Mechanical Engineering
- Plastics Injection Molding
- Microsoft Project
- Manufacturing
